Multivac Spotlights New Technologies At Pack Expo 2010

Kansas City, MO - Multivac takes the stage at this fall's Pack Expo convention with a wide variety of packaging machinery engineered for businesses of every size. At booth # E6242 at the McCormick Place Convention Center in Chicago, Illinois, October 31 through November 3, the company will also unveil its first-ever thermoformer built on an Allen Bradley/Rockwell control platform.

"Multivac's open-architecture IPC machine controls enable our packaging systems to be seamlessly integrated into any machine environment," says Jan Erik Kuhlmann, Multivac's president and CEO. "However, we realize the importance of complete flexibilty for those customers already working with an installed base of equipment running Allen Bradley controls, and Multivac is pleased to offer this alternative as well. We look forward to showcasing it along with multiple offerings at this year's Pack Expo convention."

Also included in Multivac's line-up are a high-speed R245 thermoformer equipped with robotic product handling, Multivac Vision System (MVS) and labeling. The R105, Multivac's smallest and most economical thermoformer, will be on display along with a variety of tray sealers and vacuum chamber packaging systems designed for businesses and volume requirements of every size.

Pack Expo 2010 will also mark the US exhibition debut of the new B610 belted vacuum chamber packaging system, the largest and highest-capacity machine of its kind available in North America. With its patented tilting lid, the B610 offers a host of state-of-the-art features for superior performance, easy maintenance, cost savings and energy conservation.

For more information and free admission to Pack Expo, contact Multivac at 800-800-8552 or e-mail muinc@multivac.com.

SOURCE: Multivac Inc.